SiP

Characteristics and Advantages of CorelessRF-SiPSubstrate Products (Technologies) SiP (System in Package) encapsulates several ICs and Passive Components into a single system, using this system to achieve composite functions. GeneralFeatures ● SmallerPackagesize compared to individually packaged Ics ● Thermal Characteristics Application ● PA (PowerAmplif

category：

Samsung

Model ：

1003627925963890688

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Product description
Product parameters
Product parameters

- Commodity name: SiP
- Commodity ID: 1003627925963890688
Characteristics and Advantages of CorelessRF-SiPSubstrate Products (Technologies) SiP (System in Package) encapsulates several ICs and Passive Components into a single system, using this system to achieve composite functions. GeneralFeatures ● SmallerPackagesize compared to individually packaged Ics ● Thermal Characteristics Application ● PA (PowerAmplif

SiP(System in Package)

Package several ICs and Passive Components together to form a system that can be used to achieve composite functions.

General Features

● Smaller Package size compared to individually-packaged Ics

● Heat dissipation characteristics

Application

● PA(Power Amplifier), PAD(Power Amplifier Duplexer)

● FEMID (Front-end module with integrated duplexer)

● SAW Filter, BAW Filter

Various RF accessories such as Diversity FEM and Switch