WBCSP
WBCSP
category：
Samsung
Model ：
1003627904329670656
- Product description
- Product parameters
- Product parameters
-
- Commodity name: WBCSP
- Commodity ID: 1003627904329670656
The characteristics and advantages of the product (technology) can be made into products with a thickness of less than 0.13mm, which can freely connect single chips and PCBs, as well as multiple chips and PCBs. Compared to packages with the same thickness, it ensures high performance. Why Samsung WBCSP (WireBonding Chip Scale Package) uses gold wires to connect semiconductor chips to packaging substrates. Products with semiconductor chip sizes greater than 80% of the substrate area are commonly referred to as "WBCSP" (wire bonding chip size packaging). Using gold wire to connect the chip to the substrate
WBCSP(Wire Bonding Chip Scale Package)
The use of gold wire to connect semiconductor chips to packaging substrates. Products with semiconductor chip sizes greater than 80% of the substrate area are commonly referred to as "WBCSP" (lead bonding chip size packaging).
Using gold wire to connect the chip to the substrate (PCB) can achieve multi chip packaging, mainly used on memory chips. Especially, products with a final thickness of the substrate not exceeding 0.13 millimeters are referred to as "UTCSP (Ultra Thin Chip Size Package)".
General Features- Lightweight and short (capable of making thin plates with a thickness of less than 0.13mm)
- Realize miniaturization of the final product through semiconductor chip size level packaging)
Why Samsung
Features and advantages of the product (technology)
Can produce products with a thickness of 0.13mm or less, and can freely connect single chips and PCBs, as well as multiple chips and PCBs. Compared to packages with the same thickness, it ensures high performance.
产品详情
WBCSP(Wire Bonding Chip Scale Package)
The use of gold wire to connect semiconductor chips to packaging substrates. Products with semiconductor chip sizes greater than 80% of the substrate area are commonly referred to as "WBCSP" (lead bonding chip size packaging).
Using gold wire to connect the chip to the substrate (PCB) can achieve multi chip packaging, mainly used on memory chips. Especially, products with a final thickness of the substrate not exceeding 0.13 millimeters are referred to as "UTCSP (Ultra Thin Chip Size Package)".
General Features
- Lightweight and short (capable of making thin plates with a thickness of less than 0.13mm)
- Realize miniaturization of the final product through semiconductor chip size level packaging)
Why Samsung
Features and advantages of the product (technology)
Can produce products with a thickness of 0.13mm or less, and can freely connect single chips and PCBs, as well as multiple chips and PCBs. Compared to packages with the same thickness, it ensures high performance.
Relevant accessories
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