Beijing Zhenguang Technology Co., Ltd

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FCCSP

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FCCSP

The characteristics and advantages of Certificate products (technology) are not connected to the substrate through wire bonding, but rather interconnected with the substrate through bumps in an inverted state. Therefore, they are called "FCCSP" (FlipChipChipScalePackage). Mainly used on AP (Application Processor) chips for mobile information devices. GeneralFeatures●High

category:

Samsung

Model :

1003627883471396864

  • Product description
  • Product parameters
  • Product parameters
    • Commodity name: FCCSP
    • Commodity ID: 1003627883471396864

    The characteristics and advantages of Certificate products (technology) are not connected to the substrate through wire bonding, but rather interconnected with the substrate through bumps in an inverted state. Therefore, they are called "FCCSP" (FlipChipChipScalePackage). Mainly used on AP (Application Processor) chips for mobile information devices. GeneralFeatures●High

    Wireless Power Transfer

    Semiconductor chips are not connected to the substrate through wire bonding, but are interconnected with the substrate through bumps in an inverted state, hence they are called "FCCSP" (Flip Chip Chip Scale Package).


    Mainly used on AP (Application Processor) chips for mobile information devices.


    General Features

    • High performance: Chip semiconductor ↔ Distance between PCBs
    • Minimal reduction with minimal signal loss, ensuring high performance
    • High I/O: Thanks to fine bump pitch, a large amount of I/O is formed


    Application

    • Mobile Application Processor, Baseband, etc

产品详情

Wireless Power Transfer

Semiconductor chips are not connected to the substrate through wire bonding, but are interconnected with the substrate through bumps in an inverted state, hence they are called "FCCSP" (Flip Chip Chip Scale Package).


Mainly used on AP (Application Processor) chips for mobile information devices.


General Features

  • High performance: Chip semiconductor ↔ Distance between PCBs
  • Minimal reduction with minimal signal loss, ensuring high performance
  • High I/O: Thanks to fine bump pitch, a large amount of I/O is formed


Application

  • Mobile Application Processor, Baseband, etc

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