FCCSP
FCCSP
category：
Samsung
Model ：
1003627883471396864
- Product description
- Product parameters
- Product parameters
-
- Commodity name: FCCSP
- Commodity ID: 1003627883471396864
The characteristics and advantages of Certificate products (technology) are not connected to the substrate through wire bonding, but rather interconnected with the substrate through bumps in an inverted state. Therefore, they are called "FCCSP" (FlipChipChipScalePackage). Mainly used on AP (Application Processor) chips for mobile information devices. GeneralFeatures●High
Wireless Power Transfer
Semiconductor chips are not connected to the substrate through wire bonding, but are interconnected with the substrate through bumps in an inverted state, hence they are called "FCCSP" (Flip Chip Chip Scale Package).
Mainly used on AP (Application Processor) chips for mobile information devices.
General Features- High performance: Chip semiconductor ↔ Distance between PCBs
- Minimal reduction with minimal signal loss, ensuring high performance
- High I/O: Thanks to fine bump pitch, a large amount of I/O is formed
Application- Mobile Application Processor, Baseband, etc
产品详情
Wireless Power Transfer
Semiconductor chips are not connected to the substrate through wire bonding, but are interconnected with the substrate through bumps in an inverted state, hence they are called "FCCSP" (Flip Chip Chip Scale Package).
Mainly used on AP (Application Processor) chips for mobile information devices.
General Features
- High performance: Chip semiconductor ↔ Distance between PCBs
- Minimal reduction with minimal signal loss, ensuring high performance
- High I/O: Thanks to fine bump pitch, a large amount of I/O is formed
Application
- Mobile Application Processor, Baseband, etc
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